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Projects
701.
Performability Evaluation of Grid Environments Using Stochastic Reward Nets
702.
Uncertainty-Aware Autonomic Resource Provisioning for Mobile Cloud Computing
703.
Automated fault tolerant system for control computational power in Desktop Grid
704.
Cross-Layer SLA Management for Cloud-hosted Big Data Analytics Applications
705.
Locality-Aware Stencil Computations Using Flash SSDs as Main Memory Extension
706.
Digital Control Generations — Digital Controls for Power Electronics through the Third Generation
707.
Power Electronics Cooling of 100 W/cm 2 Using AC Electroosmotic Pump
708.
A General Approach for Quantifying the Benefit of Distributed Power Electronics for Fine Grained MPPT in Photovoltaic Applications Using 3-D Modeling
709.
Using a fully digital rapid prototype platform in grid-coupled power electronics applications
710.
Grid Compliance Conditioning of Renewable Power Sources by Means of Modern Power Electronics
711.
Power Electronics Building Blocks and potential power modulator applications
712.
Power electronics building blocks – a platform-based approach to power electronics
713.
Packaging of integrated power electronics modules using flip-chip technology
714.
Circuit simulation in a research oriented education of power electronics
715.
A power electronics conversion topology for regenerative fuel cell systems
716.
Power electronics in biomedical applications – An overview
717.
The role power electronics in future energy systems and green industrialization
718.
Power quality considerations for installing sensitive electronics equipment-a utility’s perspective
719.
Improving performance of cryogenic power electronics
720.
Design of PEBB based power electronics systems
721.
Novel and ruggedized power electronics for off-highway vehicles
722.
A web-based graduate course on the Mechanical Design of High Temperature and High Power Electronics
723.
Analysis and evaluation of near field noise voltage on power electronics circuits
724.
Development of tools for the study of chaotic behavior in power electronics
725.
Chip-scale packaging of power devices and its application in integrated power electronics modules
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